Polymer Composites for Microelectronic Applications

The objective of the book is to report on the possibility of using ceramic fillers in polymers to make composites suitable for microelectronic applications. The first part of the book is on the development of theoretical heat conduction models for estimation of effective thermal conductivity of such polymer composites with single/hybrid fillers. The second part has provided the description of the materials used, routes adopted to fabricate the various composites and the details of the experiments. The last part has emphasized on the physical, mechanical, thermal and dielectric characteristics of all the epoxy and polypropylene based composites filled with single filler i.e. micro-sized AlN/Al2O3. A comparative evaluation of the effects of premixing of solid glass microspheres with AlN/Al2O3 is also presented. The polymer composites developed with enhanced thermal conductivity, improved glass transition temperature, reduced thermal expansion coefficient and modified dielectric constant are expected to have adequate potential for a wide variety of applications particularly in microelectronic industries like electronic packaging, encapsulations, printed circuit board substrates etc.